Tata Electronics has entered a partnership with Besi, the Netherlands-based supplier of semiconductor assembly equipment, to work on advanced packaging in India, EE Times India reports.

The deal pairs one of India's largest industrial groups with a company that supplies hybrid bonding and other advanced packaging tools to leading chipmakers. For Tata Electronics, the agreement marks a further step beyond its established electronics manufacturing operations and into semiconductor assembly.

What does the partnership cover?

According to the report, the two companies will cooperate on advanced semiconductor packaging — the class of technologies that connect chips into multi-die modules and are now central to delivering higher performance and energy efficiency in modern devices.

Advanced packaging has become a strategic segment of the semiconductor supply chain. It includes processes such as chip-on-wafer and wafer-level assembly, where Besi's equipment line is a significant market presence.

Why does it matter for India?

The partnership aligns with India's national effort to build domestic semiconductor capability, an initiative that has already drawn commitments from several large conglomerates and international technology partners.

Tata Electronics, part of the Tata Group, has been expanding its precision manufacturing footprint and positioning itself as a key domestic player in electronics and semiconductor production. Working with an established equipment supplier gives the company access to process technology and tooling expertise required for advanced assembly lines.

For Besi, the agreement extends its customer relationships into one of the fastest-growing electronics manufacturing markets, where governments and industry are investing heavily in local chip capacity.

What comes next?

The report does not specify a start date for the collaboration, the value of the agreement, or the particular packaging platforms the companies will deploy. Details on capacity, location of the planned lines, and production timelines are expected to follow as the partnership is implemented.

The announcement signals that advanced packaging — not just front-end wafer fabrication — is now part of India's semiconductor build-out, with domestic manufacturers aligning early with global equipment suppliers.