Die Signal — Silicon-level intelligence for the AI hardware trade — from wafer to rack.
Die Signal
LOT-C1C8WFR 300MM
DSG-2330AI Datacenter Infrastructure
Intel Details D-Series GPU and Xeon Rack Designs at OCP
Intel disclosed specifications for two new data center products — the D-series GPU and Xeon rack reference designs — at the OCP summit. Pricing, availability, and performance targets remain unpublished.
- Segment
- AI Datacenter Infrastructure
- Read
- 3 min
- Node
- 28nm
- Dated
Spec grid
- AI Datacenter Infrastructure
d-Matrix Touts "Squadron" Clusters for Data-Center-Scale Inference
d-Matrix has rolled out Squadron Compute Clusters, framing them for AI inference at data-center scale. Here's what the rack-level pitch changes for buyers, and where spe…
DSG-6994 · 7nm · 3 min
- Processors & Accelerators
Intel pitches drop-in AI card for existing data-center racks
DSG-1885 · 10nm · 2 min
- Processors & Accelerators
Intel's Crescent Island Delivers 1.3 PFLOPS FP8 for GPU D-Series
DSG-1396 · 7nm · 3 min
- Memory & Storage
CXMT to Launch 4F² Server DRAM in 2025; Micron, Samsung, SK Hynix Shares Slide
DSG-3181 · 10nm · 3 min
- Processors & Accelerators
Intel Names Crescent Island: GPU D-Series Targets AI Inference
DSG-1369 · 5nm · 3 min
Outer ring · Latest
- Microsoft Plans Large-Scale Rollout of Its Own AI Chips to Cut Costs
- Microsoft sets one million deployment target for Maia 300 AI chip
- Nvidia opens Vera Rubin rack and tray designs to OCP
- Microsoft unveils Maia 300 AI chip, targets Nvidia dependency
- Princeton Digital Group sells five Indonesian data centers to SM+
- Microsoft's Maia 300: A New AI Chip Built to Cut Costs and Latency
- Memory Stocks Slide as China's CXMT Flags Denser Chip Design
- Microsoft Announces Azure Maia 300, Discloses Almost Nothing