congatec has announced the conga-HPC/cRX1, a new COM-HPC Computer Module built on AMD Zen 5 processor technology. The module integrates a Radeon RDNA 3.5 graphics unit and a neural processing unit rated at 50 TOPS.

The conga-HPC/cRX1 targets embedded and industrial computing applications that require high CPU throughput alongside on-module AI inference and graphics performance. By combining AMD's Zen 5 CPU cores with the RDNA 3.5 GPU architecture, the module delivers general-purpose compute, graphics rendering, and accelerated machine learning workloads on a single board.

The 50 TOPS NPU figure positions the module for edge AI workloads, including vision-based inspection, object detection, and other inference tasks that previously required discrete accelerators. congatec designed the module to the COM-HPC standard, which provides the higher power budgets and bandwidth needed to feed modern multi-core processors and integrated GPUs.

System designers can use the module as a building block in medical, industrial automation, transportation, and test-and-measurement systems, where long-term availability and a standardized form factor matter as much as raw performance. The COM-HPC carrier board ecosystem lets developers prototype quickly and then deploy the same module design across product families.

The announcement extends congatec's portfolio of COM-HPC modules, which already spans multiple processor vendors. Adding an AMD Zen 5-based option gives customers a second high-performance x86 path beyond the company's existing Intel-based modules, with the distinguishing feature being the combination of integrated Radeon RDNA 3.5 graphics and the 50 TOPS-class NPU.

AMD's Zen 5 architecture brings per-core performance gains over the previous Zen generation, while RDNA 3.5 graphics improve on the compute and display capabilities available in integrated form. The integrated NPU handles AI inference at lower power draw than running the same models on CPU or GPU resources, a key consideration for thermally constrained embedded deployments.

congatec has not yet published full pricing and availability details for the conga-HPC/cRX1. The company typically ships COM-HPC modules with long-term availability guarantees and comprehensive board support packages, allowing developers to bring up Linux and Windows environments on the new platform.

The module will compete directly with other COM-HPC offerings in the embedded market, where vendors race to integrate the latest CPU and AI silicon into standardized form factors. With 50 TOPS of NPU performance on board, the conga-HPC/cRX1 meets the threshold many edge AI deployments now demand.