Test report DSG-9266 · Rev E · tested October 15, 2026
Memory & StorageDevice under test
Big Tech Reported Moving Off Nvidia Chips — Opening for Samsung, SK hynix
Businesskorea reports Big Tech is moving away from Nvidia, framing a potential HBM opening for Samsung and SK hynix. Details remain thin — here's what to watch.
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- Grace Kim
Spec summary
- Businesskorea reports Big Tech players are moving away from Nvidia as an AI chip supplier
- The report frames the shift as a potential opportunity for Samsung Electronics and SK hynix
- No order volumes, specifications or executive quotations were disclosed in the surfaced report
- Both Korean firms supply HBM, the stacked memory used alongside AI accelerators
By Grace Kim
The headline number in this story is structural, not a figure: Businesskorea reports that major Big Tech players are moving away from Nvidia — and frames that shift as a potential opening for Samsung Electronics and SK hynix.
That's a loaded claim for the memory market. Samsung and SK hynix supply the high-bandwidth memory (HBM — stacked DRAM that sits next to AI accelerators and feeds them data) that goes into Nvidia's top GPUs. Any change in how hyperscalers buy AI silicon ripples straight into Korean memory order books.
What does this change for Samsung and SK hynix?
Potentially a lot, potentially nothing yet. The report is a question, not a confirmed design win. If Google, Amazon, Microsoft or Meta accelerate in-house AI chips — the most common driver cited when Big Tech "moves away from Nvidia" — then HBM demand doesn't disappear. It shifts supplier mix. Samsung, which has fought for HBM qualification at Nvidia, could court hyperscaler internal programs instead. SK hynix, currently the HBM leader, would need to defend share on new sockets.
Why hyperscalers want out from under one vendor
- Nvidia controls the bulk of AI training accelerators, giving it pricing power hyperscalers resent.
- Custom silicon — Google's TPU line, Amazon's Trainium, Microsoft's Maia — cuts cost per token and locks in supply.
- Diversification protects AI roadmaps from single-vendor allocation crunches of the kind seen through 2023-2024.
Each of those custom chips needs memory. That's the Korean angle.
The caution flag
The source article, as surfaced, provides the thesis without disclosed specifications, order volumes or executive quotations. Treat the Samsung-SK hynix opportunity as market framing, not a booked contract. We'll follow with specifics — HBM3E (the current-generation high-bandwidth memory standard) shipment figures, qualification status, customer names — as they land.
For now, the trade is this: watch hyperscaler capex disclosures and any Korean memory guidance revisions. Those numbers will confirm or kill the thesis.
via Google News: HBM memory (Source)
More from Grace Kim
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Market editor covering regulation, policy and their impact on hardware layer of artificial intelligence at Die Signal.
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